Dynasolve 700 Series
Cured Polymer Cleaning Solvents
- More efficient than acetone, MEK & other solvents
- All⬐in⬐one product works on several types of polymers
- Formulated to be highly selective
- High resin loading capacity allows for reuse and reduced cost of ownership
Product information
The Dynasolve 700 series solvents are reactive formulated solvents which are used to remove anhydride-cured epoxy, urethane, and silicone. The solvents are used in both industrial and electronic applications. The four products differ in terms of aluminium compatibility, the presence or not of the solvent NMP, and REACH compliance (see comparison below).
APPLICATIONS
Depoting and decapsulating electronic components, Industrial polymer removal and cleaning
INDUSTRIAL USE
Dynasolve 700 Series are compatible with the following materials: Most metals, Teflon®, Polyethylene & Polypropylene, and Neoprene. Avoid the following materials: Galvanized steel & Titanium, Liquid Isocyanate, Vinyl, Lucite®, and Plexiglas & Polystyrene.
Dynasolve 700 Series removes the following materials: Anhydride⬐cured epoxy, Urethane, and Silicone.
SPECIFICATIONS
Dynasolve 715
Contains NMP: No
REACH Compliant: Yes
24 hour Aluminium Compatibility: Yes
Flash Point: 41°C
Boiling Point: 120°C
Specific Gravity: 0.99
Dynasolve 760
Contains NMP: No
REACH Compliant: Yes
24 hour Aluminium Compatibility: No
Flash Point: 41°C
Boiling Point: 120°C
Specific Gravity: 1.01
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