Dynasolve 700 Series

Solvents | Cured Polymer Cleaning Solvents

  • More efficient than acetone, MEK & other solvents 
  • All‐in‐one product works on several types of polymers
  • Formulated to be highly selective
  • High resin loading capacity allows for reuse and reduced cost of ownership

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Product information


The Dynasolve 700 series solvents are reactive formulated solvents which are used to remove anhydride-cured epoxy, urethane, and silicone. The solvents are used in both industrial and electronic applications. The four products differ in terms of aluminium compatibility, the presence or not of the solvent NMP, and REACH compliance (see comparison below).


APPLICATIONS

Depoting and decapsulating electronic components, Industrial polymer removal and cleaning


INDUSTRIAL USE

Dynasolve 700 Series are compatible with the following materials: Most metals, Teflon®, Polyethylene & Polypropylene, and Neoprene. Avoid the following materials: Galvanized steel & Titanium, Liquid Isocyanate, Vinyl, Lucite®, and Plexiglas & Polystyrene.


Dynasolve 700 Series removes the following materials: Anhydride‐cured epoxy, Urethane, and Silicone.


SPECIFICATIONS

Dynasolve 715 

Contains NMP: No

REACH Compliant: Yes

24 hour Aluminium Compatibility: Yes

Flash Point: 41°C

Boiling Point: 120°C

Specific Gravity: 0.99



Dynasolve 760

Contains NMP: No

REACH Compliant: Yes

24 hour Aluminium Compatibility: No

Flash Point: 41°C

Boiling Point: 120°C

Specific Gravity: 1.01



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Dynasolve 700 Series